Intel has made public the draft specifications for its Super Speed USB 3.0 chip, which is capable of transferring data at an amazing speed of 4.8 Gbps (ed: Expect real speeds to be much less), and said to consume lower power than its predecessor USB 2.0.
The company has published details of revision 0.9 for its Extensible Host Controller Interface (xHCI), which would assist the USB 3.0 host controllers in communicating with the USB 3.0 software assembly.
The chip is developed with an aim to provide excellent interoperability within various devices, which would remarkably help in designing software support for the market.
This move from the computer chip giant has provided a sigh of relief to its competitors - AMD and Nvidia, as common xHCI specifications would help the market in delivering high-quality content to its end users.
Expressing his satisfaction on this move from Intel, AMD’s VP and GM for its Chipset Unit, Phil Eisler said, “USB 3.0 is an answer to future the bandwidth need of the PC platform”, and mentioned AMD’s support for common xHCI specifications.
USB 3.0 products are expected to hit the market in 2009.
The company has published details of revision 0.9 for its Extensible Host Controller Interface (xHCI), which would assist the USB 3.0 host controllers in communicating with the USB 3.0 software assembly.
The chip is developed with an aim to provide excellent interoperability within various devices, which would remarkably help in designing software support for the market.
This move from the computer chip giant has provided a sigh of relief to its competitors - AMD and Nvidia, as common xHCI specifications would help the market in delivering high-quality content to its end users.
Expressing his satisfaction on this move from Intel, AMD’s VP and GM for its Chipset Unit, Phil Eisler said, “USB 3.0 is an answer to future the bandwidth need of the PC platform”, and mentioned AMD’s support for common xHCI specifications.
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